Semiconductor
Fab digitalization per SEMI E10/E79/E58 standards and ISO 14644 cleanroom
Both products — CMMS and OEE — are specialized for SEMI E10 (six equipment states), SEMI E58/E116 (automated RAM), SEMI E79/TEEP (fab performance), and SECS/GEM/GEM300 (E87/E90/E94) — grounded in how a real fab operates, from cleanroom to WIP-coordinated maintenance scheduling.
SEMI E10 (RAM/Utilization)SEMI E79 (Fab OEE)SEMI E58 (ARAMS)SECS/GEM/GEM300ISO 14644 (Cleanroom)
Specialized by product
CMMSCMMS for Semiconductor Fabs — SEMI E10's Six States and Cleanroom ConstraintsA technician flips a broken tool's state to 'Standby' to hide downtime — the CMMS logs it as fine while it's actually completely down. This is why fab CMMS can't be separated from SEMI E10.Read articleOEEOEE for Semiconductor Fabs — When One Score Isn't Enough at the Fab LevelAn EUV scanner hits an excellent 85% OEE — but TEEP is only 18% because the fab runs a single shift. The CFO needs both numbers to make the right call: buy another tool or add a shift.Read article